PCB Assembly
Mixed SMT + DIP, single- or dual-sided. Turnkey or consignment; MOQ 1 pc to 100,000+. Prototypes in 5–7 working days, 72 h expedite for simple boards.
PCB assembly >
Capabilities
From 01005 passives to 32-layer rigid-flex
Boards from 1 to 32 layers — rigid, flex, rigid-flex and metal-core — assembled at ±0.025 mm with 0.25 mm BGA support. Turnkey or consignment, MOQ 1 pc, quote in 1 business day.
Capability matrix
The numbers, in one table
If a parameter you need is not listed, send the BOM — the DFM review answers within 1 business day.
| Capability | Specification |
|---|---|
| Board types | Rigid 1–32 layers, flex, rigid-flex, metal-core (aluminum / copper) |
| Max board size | 460 × 500 mm |
| Smallest passive | 01005 (0.4 × 0.2 mm) |
| Min BGA pitch | 0.25 mm — 100% X-ray on hidden joints |
| Min QFN pitch | 0.3 mm |
| Placement accuracy | ±0.025 mm |
| Line capacity | 150,000+ CPH across 4 SMT lines |
| Daily throughput | 3,000,000+ placements per day |
| Service models | Turnkey / consignment / partial turnkey |
| Order size | MOQ 1 pc to 100,000+ pcs |
| Prototype lead time | 5–7 working days turnkey; 72 h expedite for simple boards |
| Workmanship | IPC-A-610 Class 2 default, Class 3 on request |
| Test chain | SPI / AOI / X-ray / flying probe / ICT / FCT |
| Box-build | L1–L5 integration, IPC-CC-830 coating, burn-in 24–168 h |
Services
Three ways we build
Each service has its own page with parameters, process detail and a quote path.
SMT Assembly
4 lines at 150,000+ CPH; SPI → AOI → X-ray inline on every board. 01005 passives, 0.25 mm BGA, 300+ part numbers introduced per year.
SMT assembly >Box-Build
L1–L5 integration: cables, enclosures, firmware. IPC-CC-830 coating, burn-in 24–168 h, serial traceability and export-ready packing.
Box-build & coating >Test & inspection
Six test technologies, one duty cycle
Inspection runs inline on every board; electrical test is chosen by volume, not by margin.
Inline inspection
SPI checks 100% of paste deposits before placement; AOI checks 100% of boards after reflow. Defect maps are returned with the build report, so closures are visible rather than verbal.
Hidden-joint X-ray
100% X-ray coverage on BGA, QFN and LGA connections — the joints optical systems cannot see are the ones we image on every board, with void-rate thresholds agreed in advance for Class 3 builds.
Electrical & reliability
Flying probe for prototypes, ICT fixtures for volume, FCT to your bench spec. Reliability options include 24–168 h burn-in and temperature cycling, with results logged per serial number.
Before you ask
Four numbers that shape your quote
1 pc
Minimum order — prototypes and production runs share the same MOQ.
1 day
Quote turnaround — priced offer with DFM notes in one working day.
5–7 days
Turnkey prototypes — 72-hour expedite for simple 1–2 layer boards.
15–20 days
Typical production build after parts are confirmed at the dock.
Sourcing & BOM
Parts bought once, screened twice
Turnkey orders are purchased through authorized distribution channels. Before the PO, every line goes through an EOL and PCN screen — industrial equipment lives 15–25 years while some ICs are discontinued in under 10, often without notice.
- EOL / alternate flags with data sheets, so substitutions are your decision, not a surprise.
- Passives carry a 5–10% overage per industry convention; date codes agreed before purchase.
- Consignment kits verified line-by-line against the BOM on arrival, shortages reported same day.
- CoC and batch/date-code records ship with every kit, RoHS/REACH declarations on file.
For long-life industrial programs we also hold approved-alternate lists per project, so a mid-run shortage is answered from a qualified second source instead of stopping the line.
