Moisture-sensitive devices
MSL 1–6 floor life is tracked per J-STD-020/033; reels live in dry cabinets below 5% RH, and each unzip is logged with humidity indicator cards. Baked recovery follows the standard's schedule.
SMT Assembly
SMT at ±0.025 mm, on four lines
150,000+ CPH combined and 3,000,000+ components placed per day. Boards up to 460 × 500 mm, single- or dual-sided; SPI before placement and 100% AOI after reflow on every panel.
±0.025 mm · 01005 · 0.25 mm BGA · 100% AOI + X-ray on hidden joints
Fine pitch
Fine pitch is a process, not a promise
Placement modules hold ±0.025 mm accuracy across the board area — enough margin for 01005 passives at 0.4 × 0.2 mm and BGA packages at 0.25 mm pitch, verified by X-ray rather than trust.
What the line handles
- 01005 passives with a dedicated nozzle and feeder set, joint-checked under AOI.
- BGA to 0.25 mm and QFN to 0.3 mm pitch — 100% X-ray on every hidden joint.
- Laser-cut stencils at ±0.02 mm grade tolerance, with stencil engineering support on apertures before the steel is cut.
Mini case: a 484-ball, 0.25 mm-pitch BGA ran with reduced-aperture stencil design and full X-ray sampling; first pass yield held at 99.6% across 260 panels.
Panels up to 460 × 500 mm run single- or double-sided, and dual-sided builds are reflowed twice with the second-side glue-dot or high-tack paste process chosen at DFM — decided before the stencil is ordered, not after the first drop.
Print & reflow
Three stations decide most of the yield
Most SMT defects are born at printing and reflow — so those two steps are measured on every panel.
1
Print & verify
Fully automatic printers with laser-cut stencils at ±0.02 mm grade tolerance; inline SPI then measures 100% of deposits before a board moves on.
Your part: approve any aperture changes proposed by stencil engineering.
2
Place
Placement at ±0.025 mm covers 01005 through 45 × 45 mm ICs. Between part numbers, the changeover target is ≤30 minutes — the mechanism behind 300+ NPI part numbers a year.
Your part: send centroid (pick-and-place) data with the Gerbers.
3
Reflow
Multi-zone ovens run programmable profiles peaking at 240–255 °C for lead-free assemblies; a profiling board records the curve for each new build.
Your part: flag any component temperature limits before profiling.
AOI & X-ray
Every board inspected, every hidden joint imaged
Inspection data loops back into the line within the same shift.
AOI camera gantry, line side
100% coverage, on every line — defects loop back within the shift
- AOI, 100% — post-reflow optical check on every board, every line.
- X-ray, 100% of hidden joints — every BGA and QFN imaged, not sampled.
- Closed loop — inspection data feeds back to the printer and placer in the same shift.
- Records travel — AOI and X-ray results attach to the traceability file in your CoC.
MSD & ESD
Two silent killers, two standing programs
Moisture and static damage are invisible at final test — control happens at storage and handling, not at the end of the line.
ESD control
An ANSI/ESD S20.20 program runs floor-wide: grounded benches, wrist straps and ESD flooring, checked at every quality gate — the same program auditors see on a factory visit.
Lead times
5–7 working days, 72 hours if it's simple
300+ part numbers a year with a ≤30-minute changeover target keep prototype slots honest; quotes with DFM notes return in 1 business day. Expedite slots are reserved for simple boards, and we will tell you plainly if yours is not one of them — the 72-hour option depends on stencil availability and sourcing coverage, both confirmed before we promise a date.
